NexoraGPU
NexoraGPU
Empowering Hyperscalers, AI Startups, and Cloud Service Providers with Disaggregated White-Box Infrastructure and OEM/ODM Customization
The Open Compute Project (OCP) redefines data center scalability. By removing proprietary hardware lock-ins, OCP specs enable modular, disaggregated compute, storage, and networking architectures that significantly slash Total Cost of Ownership (TCO).
Migrating from traditional 12V busbars to centralized 48V power distribution architectures minimizes conversion losses, optimizes power delivery to high-TDP GPU clusters, and substantially reduces PUE (Power Usage Effectiveness) metrics.
Off-the-shelf tier-1 hardware often fails to address customized AI model training demands. Enterprise ODM services deliver modified mechanical chassis, custom backplanes, specialized cooling loops, and tailored BIOS/BMC firmware.
Detailed technical benchmarking showing why hyperscalers and AI infrastructure engineers transition to customized OCP hardware configurations.
| Specification Metric | Legacy 19-Inch EIA Rack System | OCP Open Rack V3 (ORv3) Standard | Nexora OEM/ODM Custom Solution |
|---|---|---|---|
| Equipment Width / Space | 19 Inches (482.6 mm) Outer Width | 21 Inches (533.4 mm) Inner Tray Space | Hybrid 19" & 21" Compatible Chassis |
| Power Delivery Architecture | Distributed 12V Power Supplies per Chassis | Centralized 48V Busbar Power Shelf | Dual-Input 48V High-Density Smart Busbar |
| Thermal & Cooling Vector | Air-cooled Front-to-Back High CFM Fans | Integrated Direct-to-Chip (D2C) Liquid Loops | Hybrid Immersion & Liquid-to-Air Cooling |
| Serviceability & Cable Design | Rear Cabling Complexity (Thermal Blockage) | 100% Blind-Mate Front Serviceability | Tool-less Blind-Mate PCIe & Power Modules |
| Max Power Density per Rack | 10kW to 20kW per Rack Cabinet | Up to 100kW+ per Open Rack V3 Shelf | Custom Design up to 120kW for AI Clusters |
With thermal design power (TDP) for modern GPUs surpassing 700W to 1000W per socket, legacy air cooling reaches physical limits. Our ODM engineering teams build OCP-compliant cold-plate liquid loops and immersion-ready chassis capable of maintaining optimal junction temperatures under continuous 100% compute stress.
Compute Express Link (CXL) technology allows memory pooling and hardware disaggregation. By manufacturing OCP-compliant memory expansion sleds and PCIe Gen 5/6 switch fabrics, we enable data centers to scale DRAM and NVMe storage dynamically without stranding compute resources.
From initial CAD architecture designs to global white-glove rack-level integration, our NPI (New Product Introduction) workflow guarantees seamless hardware delivery.
Technical consultation covering TDP profiles, PCIe lane allocations, thermal envelopes, form factor constraints, and target TCO objectives.
128 R&D engineers construct 3D thermal simulations, high-speed PCB layouts (Signal Integrity optimization), and custom motherboard schematics.
Rapid deployment of functional prototypes subjected to 100% burn-in, thermal chamber stress tests, EMI validation, and vibration testing.
Mass manufacturing leveraging 1,250+ supply chain partners, 42 dedicated QC engineers, CE/FCC compliance checks, and global export shipping.
Delivering targeted infrastructure optimized for Large Language Model (LLM) training, DeepSeek-R1 deployments, and High-Performance Cloud Storage.
Modern AI models require massive parallel processing and ultra-fast interconnects. Our multi-GPU server designs support 8-way and 16-way GPU topologies connected via high-bandwidth SXM or PCIe switches, optimized for DeepSeek AI, OpenAI, and custom LLM model fine-tuning.
To minimize operational expenditure, hyperscale facilities demand standardized, modular rack-level units. We export OCP-ready servers engineered for zero-downtime maintenance, hot-swappable fan trays, dual-redundant busbars, and centralized open-source BMC telemetry (OpenBMC).
For data-intensive workloads like real-time analytics and video streaming, our 2U and 4U high-density storage servers offer maximum PCIe Gen 5 NVMe drive density, delivering millions of IOPS with minimal latency across all storage nodes.
How Next-Generation Standards (PCIe 6.0/7.0, 800G Networking, and Liquid Cooling) Shape Hardware Procurement
As network backbones scale up to handle gigabytes of data per millisecond, traditional 100G interfaces create severe bottlenecks. The OCP NIC 3.0 specification, coupled with upcoming 800G and 1.6T optical interconnects, allows data centers to stream multi-terabit network traffic directly into GPU memory banks via RDMA over Converged Ethernet (RoCE v2).
Transitioning from NRZ to PAM4 signaling in PCIe 6.0 doubles data transfer rates to 64 GT/s per lane. Our OEM hardware engineering pipeline integrates low-loss substrate materials (Megtron 7/8 PCBs) and retimers to preserve signal integrity across long traces in disaggregated server chassis.
Nexora Intelligent Technology Co., Ltd. | Brand: NexoraGPU
Founded in 2017, Nexora Intelligent Technology Co., Ltd. is a professional manufacturer specializing in high-performance GPU servers, AI computing systems, HPC clusters, storage servers, and customized data center infrastructure solutions. With a modern production facility covering 386㎡, we provide reliable and scalable computing platforms for enterprises, AI startups, research institutes, universities, cloud service providers, and data centers worldwide.
Leveraging 9 years of industry experience and 6 years of export experience, NexoraGPU has established a strong reputation in the global AI computing market. Our annual export revenue exceeds US$18 million, serving customers across North America, Europe, Southeast Asia, the Middle East, and South America.
We maintain a rigorous quality management system supported by 42 professional quality control personnel. Every product undergoes comprehensive testing procedures, including component verification, burn-in testing, thermal performance testing, power stability testing, compatibility validation, and final system inspection before shipment. Quality inspection methods include 100% functional testing, aging tests, and performance benchmarking to ensure reliable operation in demanding environments.
NexoraGPU operates as an OEM & ODM manufacturer with direct export capabilities, supported by a robust network of more than 1,250 supply chain partners. Our primary customers include AI solution providers, cloud computing companies, system integrators, research institutions, government projects, universities, and enterprise data centers.
Innovation remains at the core of our business. Our in-house R&D department consists of 128 experienced engineers specializing in server architecture, thermal design, AI infrastructure deployment, and hardware optimization. We offer comprehensive customization services, including GPU configuration, chassis design, storage architecture, networking solutions, branding, firmware optimization, and rack-level deployment.
Last year alone, NexoraGPU successfully launched 86 new products, further expanding our portfolio of AI servers, GPU workstations, edge computing systems, and enterprise storage platforms. Our advanced R&D capabilities enable us to rapidly develop tailored solutions that meet the evolving requirements of artificial intelligence, machine learning, deep learning, scientific computing, and cloud infrastructure applications.
Driven by innovation, quality, and customer success, NexoraGPU is committed to delivering high-performance computing solutions that empower the next generation of AI and digital transformation worldwide.
Addressing Common Engineering, Compliance, and Procurement Queries for OCP & Custom ODM Projects
